HARMST 007 7th International Workshop on
High-Aspect-Ratio Micro-Structure Technology
Besançon, France, June 7>9, 2007

ANNOUNCEMENT

HARMST-007 is the 7th International Workshop on High-Aspect-Ratio Micro-Structure Technology.

The purpose of the HARMST international workshop is to share information on all aspects of high-aspect-ratio technology including design, modeling, fabrication, testing, and applications.
This workshop has established itself as the premier forum for reporting progress on high-aspect-ratio micro-structure technology (HARMST).

HARMST-007 is finished !!

Next workshop : HARMST 2009, Saskatoon, Canada (http://www.harmst.ca/).

Proceedings

The final manuscripts for all accepted papers, as in the previous workshops, will be collected at the Workshop.
They will then be peer-reviewed for publication of the Proceedings in the Microsystems Technologies Journal by Springer Publishing Company.

The authors need to directly submit their full papers through the webpage for peer review as 'Special Issue : HARMST2007' in the Journal of Microsystem Technologies : http://www.editorialmanager.com/microsys.

The authors, after registering themselves and logging in as authors, will select the link to submit a new manuscript.
They should then choose as 'article type : Special Issue:HARMST 2007'.

Submission deadline for full papers : July 15th 2007

HARMST-007 conference chairs

  • Chantal Khan Malek, FEMTO-ST / LPMO, Besançon, France (conference chair).
  • Bertrand Fillon, CEA / LITEN, Grenoble, France (co-chair)
  • Volker Saile, IMT, Forschungszentrum & Universität Karlsruhe, Germany (co-chair)
LEA  FEMTO-ST  SFMC  4µ  MICROSAPIENT

Other Links

Workshop location and dates

June 7-9, 2007

Chambre du Commerce et de l'Industrie du Doubs (CCI du Doubs) 46 avenue Villarceau 25000 Besançon - France

CCI du Doubs

Important dates

Deadline for submission of a 2-page abstract :
January 30, 2007
Notification of acceptance :
March 30, 2007
Registration available :
April 2007
Submission of camera-ready paper:
on-line submission to Journal of Microsystem Technologies (MST): OPEN